SKU | 7000122496 |
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Legacy SKU | 70002511353 |
UPC | 00021200131417 |
Catalog Number | 583 |
Product Number | 583 |
3M Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
- Flexible
- Heat or solvent activation
- Can be die-cut
- Slight surface tack
- Heat crosslinkable option
- Lower temperature lamination of the nitrile phenolic film range
Product Dimensions |
Imperial | Metric |
Weight | 0 NULL | |
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Width | 0 null | |
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Thickness | 5 mm |
Shipping Dimensions |
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Weight | 11.90055 lb |
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Length | 8.50394 in |
Width | 8.50394 in |
Height | 13.18898 in |
Color | Brown |
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PRODUCT FAQ
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How does 3M™ Thermal Bonding Film 583 work for bonding applications?
3M™ Thermal Bonding Film 583 is a heat-activated adhesive film that bonds well to a variety of substrates when heat and pressure are applied, providing strong and durable bond lines.
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Is the sizing of this thermal bonding film suitable for my specific project needs?
The dimensions of the 3M™ Thermal Bonding Film 583 at 18 inches in width by 60 yards in length provide bulk quantities ideal for large-scale projects or continuous manufacturing processes.
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Can I purchase multiple cases of this thermal bonding film if needed?
Yes, you can order multiple cases of the 3M™ Thermal Bonding Film 583 to accommodate your requirements. Just let us know how many cases you need, and we'll be happy to assist you with your order.
Our hot melt film adhesive is designed to create a durable and long-lasting bond when applied to various surfaces. Whether you need to join two materials together or secure an object in place, this adhesive is up to the task. Its strong bonding capabilities ensure that your project stays intact, even under challenging conditions.
The adhesive can be used for splicing of glass fabric during PCB board manufacturing.When it comes to PCB board manufacturing, precision and reliability are crucial. Our hot melt film adhesive is specifically formulated to meet the demands of this industry. It is ideal for splicing glass fabric, ensuring a seamless and secure connection between different components. With this adhesive, you can trust that your PCB boards will be built with the utmost precision and quality.
Can be solvent activated in the uncured form.In its uncured form, our hot melt film adhesive can be activated using solvents. This feature provides flexibility and convenience during the application process. By using solvents, you can easily adjust the adhesive's properties to suit your specific needs. Whether you require a faster curing time or a stronger bond, solvent activation allows for customization and control.