SKU | 7000047509 |
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Legacy SKU | 70002511114 |
UPC | 00021200034350 |
Catalog Number | 583 |
Product Number | 583 |
3M Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
- Flexible
- Heat or solvent activation
- Can be die-cut
- Slight surface tack
- Heat crosslinkable option
- Lower temperature lamination of the nitrile phenolic film range
Product Dimensions |
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Thickness | 5 mm |
Shipping Dimensions |
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Weight | 19.70051 lb |
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Length | 10.7874 in |
Width | 10.7874 in |
Height | 10 in |
Color | Brown |
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PRODUCT FAQ
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What are the key features of 3M™ Thermal Bonding Film 583?
The 3M™ Thermal Bonding Film 583 is a reliable adhesive film that bonds well to various substrates, providing a strong and durable bond. It offers good high-temperature performance and can be easily applied with heat activation.
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How much product is there in one case of 3M™ Thermal Bonding Film 583?
Each case contains 48 rolls of the thermal bonding film, with each roll measuring three-quarters of an inch wide by 60 yards long. This bulk packaging makes it convenient for larger projects or frequent use.
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Can this thermal bonding film be used for both indoor and outdoor applications?
Yes, the 3M™ Thermal Bonding Film 583 is suitable for use both indoors and outdoors. It has excellent resistance to environmental factors like moisture, making it versatile for a variety of bonding needs.
Our hot melt film adhesive is designed to create a durable and long-lasting bond when applied to various surfaces. Whether you need to join two materials together or secure an object in place, this adhesive is up to the task. Its strong bonding capabilities ensure that your project stays intact, even under challenging conditions.
The adhesive can be used for splicing of glass fabric during PCB board manufacturing.When it comes to PCB board manufacturing, precision and reliability are crucial. Our hot melt film adhesive is specifically formulated to meet the demands of this industry. It is ideal for splicing glass fabric, ensuring a seamless and secure connection between different components. With this adhesive, you can trust that your PCB boards will be built with the utmost precision and quality.
Can be solvent activated in the uncured form.In its uncured form, our hot melt film adhesive can be activated using solvents. This feature provides flexibility and convenience during the application process. By using solvents, you can easily adjust the adhesive's properties to suit your specific needs. Whether you require a faster curing time or a stronger bond, solvent activation allows for customization and control.