SKU | 7000028859 |
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Legacy SKU | 70006026275 |
UPC | 00021200046001 |
Catalog Number | 583 |
Product Number | 583 |
3M Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
- Flexible
- Heat or solvent activation
- Can be die-cut
- Slight surface tack
- Heat crosslinkable option
- Lower temperature lamination of the nitrile phenolic film range
Product Dimensions |
Imperial | Metric |
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Width | 0 null | |
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Thickness | 5 mm |
Shipping Dimensions |
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Weight | 23.99952 lb |
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Length | 10.90551 in |
Width | 10.90551 in |
Height | 12.99213 in |
Color | Brown |
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PRODUCT FAQ
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What are the main features of 3M™ Thermal Bonding Film 583?
The 3M™ Thermal Bonding Film 583 is a high-performance adhesive film that offers excellent bond strength, flexibility, and durability. It provides a strong bond between various substrates while maintaining good thermal and chemical resistance.
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How large is each roll of the 3M™ Thermal Bonding Film 583?
Each roll of the 3M™ Thermal Bonding Film 583 measures at 2 inches wide by 60 yards in length. This size makes it convenient for various bonding applications without frequent replacements.
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Is there any special packaging or quantity options available for the product?
Yes, the 3M™ Thermal Bonding Film 583 comes in bulk packaging with each case containing a total of 24 rolls. This allows customers to stock up on this reliable bonding solution for multiple projects or continuous use.
Our hot melt film adhesive is designed to create a durable and long-lasting bond when applied to various surfaces. Whether you need to join two materials together or secure an object in place, this adhesive will provide the strength and reliability you need.
The adhesive can be used for splicing of glass fabric during PCB board manufacturing.When it comes to PCB board manufacturing, precision and reliability are crucial. Our hot melt film adhesive is specifically formulated to meet the demands of splicing glass fabric during this process. It ensures a secure and seamless bond, allowing for efficient and effective production of high-quality PCB boards.
Can be solvent activated in the uncured form.In its uncured form, our hot melt film adhesive can be activated using solvents. This feature provides flexibility and convenience, allowing for easy application and adjustment. Whether you prefer solvent activation or other methods, our adhesive offers versatility to suit your specific needs.