SKU | 7100157899 |
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Legacy SKU | XA006799515 |
UPC | 08887862329003 |
Catalog Number | 2688A |
Product Number | 2688A |
3M Universal Cover Tape (UCT) 2688A is specially designed with a transparent polypropylene film and synthetic room temperature pressure sensitive adhesive (PSA) strips. It also has static dissipative film on the component side.
- Transparent polypropylene film tape with layer of static dissipative coating on the component side and a synthetic, room temperature pressure sensitive adhesive strip along each edge
- Features an innovative peeling design with repeatable tracks and score lines to remove only the center part of the cover tape
- Designed to offer smooth peeling performance with a tight range, helping reduce vibration and component movement, while increasing overall pick-and-place productivity
- Highly recommended for WLCSP, bare dies and ultra-thin packages that require a high performing cover tape
- Works well on 3M™ Polycarbonate Carrier Tapes
- 300 m rolls are available in standard widths of 5.4 mm, 9.3 mm, 13.3 mm and 21.3 mm
Product Dimensions |
Imperial | Metric |
Weight | 0 NULL | |
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Width | 0 null | |
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Height | 0 null | |
Thickness | 0.002 in | 0.048 mm |
Shipping Dimensions |
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Weight | 6.17294 lb |
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Length | 10.35394 in |
Width | 10.35394 in |
Height | 9.60591 in |
PRODUCT FAQ
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What are the dimensions of the 3M™ Universal Cover Tape (UCT) 2688A in the 2D Pack?
The dimensions of the UCT 2688A in the 2D Pack are 13.3 mm wide and with a length of 300 meters per roll, making it versatile for various applications.
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How many rolls come in a case of the 3M™ Universal Cover Tape (UCT) 2688A?
There are a total of 10 rolls included in each case of the UCT 2688A, providing you with ample supply to meet your needs.
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Is the UCT 2688A suitable for automated application processes?
Yes, the UCT 2688A is designed for use with automated equipment, offering reliable performance and ease of integration into production lines.
3M Cover Tape 2688A is a high-quality tape designed to provide a seamless and efficient peeling process. It is specifically developed to cater to the needs of various applications, including wafer level chip scale packages (WLCSP), bare dies, and ultra-thin packages.