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SKU 7100157897
Legacy SKU XA006798079
UPC 08887862044616
Catalog Number 2688A
Product Number 2688A

3M Universal Cover Tape (UCT) 2688A is specially designed with a transparent polypropylene film and synthetic room temperature pressure sensitive adhesive (PSA) strips. It also has static dissipative film on the component side.

  • Transparent polypropylene film tape with layer of static dissipative coating on the component side and a synthetic, room temperature pressure sensitive adhesive strip along each edge
  • Features an innovative peeling design with repeatable tracks and score lines to remove only the center part of the cover tape
  • Designed to offer smooth peeling performance with a tight range, helping reduce vibration and component movement, while increasing overall pick-and-place productivity
  • Highly recommended for WLCSP, bare dies and ultra-thin packages that require a high performing cover tape
  • Works well on 3M™ Polycarbonate Carrier Tapes
  • 300 m rolls are available in standard widths of 5.4 mm, 9.3 mm, 13.3 mm and 21.3 mm
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On it's way to you February 14  

Qty

Minimum Order 25 Rolls
Order Increment 25 Rolls
Product Dimensions
Imperial Metric
Weight 0 NULL
Width 0 null
Length 0 null
Height 0 null
Thickness 0.002 in 0.048 mm
Shipping Dimensions
Weight 10.69242 lb
Length 10.35394 in
Width 10.35394 in
Height 14.4878 in

PRODUCT FAQ

  1. Sure, I'd be happy to help!

    What are the dimensions of the 3M™ Universal Cover Tape (UCT) 2688A, 2D PACK ROLL?

  2. The dimensions of this cover tape are 9.3 mm x 300 m per roll.

    How many rolls come in a case of the 3M™ Universal Cover Tape (UCT) 2688A, 2D PACK ROLL?

  3. There are a total of 25 rolls in each case of this cover tape product.

    Can you provide more details about the packaging of the rolls in the case?

  4. Each roll is individually packed for convenience and protection to ensure they remain clean and free from damage until ready for use.

3M Cover Tape 2688A

3M Cover Tape 2688A is a high-quality tape designed to provide a seamless and effortless peeling process. It is specifically developed to cater to the needs of various applications such as wafer level chip scale packages (WLCSP), bare dies, and ultra-thin packages.

Other Products in this Family

Lead times are estimates and may vary based on our suppliers' product availability.