SKU | 7100223141 |
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Legacy SKU | JT200096850 |
UPC | 00051111909232 |
Catalog Number | 3305 |
Product Number | 3305 |
3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
Product Dimensions |
Imperial | Metric |
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Shipping Dimensions |
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Weight | 8.81849 lb |
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Length | 12.99213 in |
Width | 11.02362 in |
Height | 11.41732 in |
Color | Transparent |
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PRODUCT FAQ
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bsolutely, I'd be happy to help with that!
What are the main features of 3M™ Polyester Delaminating Tape 3305?
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The 3M™ Polyester Delaminating Tape 3305 is designed for delamination of a wide variety of materials. It offers excellent adhesion and clean removability.
What size does the 3M™ Polyester Delaminating Tape 3305 come in?
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Each roll measures at approximately 310 mm x 100 m, providing plenty of tape for your needs.
How many rolls come in a case of the 3M™ Polyester Delaminating Tape?
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A case includes one roll of the durable and high-quality 3M™ Polyester Delaminating Tape
Can this tape be used on different surfaces?
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Yes, you can use this tape on various surfaces due to its versatile design and adhesive strength.
Is the application process easy for this tape?
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Absolutely! You'll find applying this delaminating tape straightforward and hassle-free.
Introducing our innovative transparent polyester film tape, specially engineered with an aggressive rubber adhesive. This tape is specifically designed to effectively remove silicon wafer backgrinding tape, ensuring a seamless and efficient process.