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3M™ Thermally Conductive Silicone Interface Pad 5583S, 210 mm x 300 mm x 2.0 mm
$37.71 / Sheet
| SKU | 7100099386 |
|---|---|
| Legacy SKU | WX300950606 |
| UPC | 08806080063964 |
| Catalog Number | 5583S |
| Product Number | 5583S-20 |
3M Thermally Conductive Silicone Interface Pad 5583S is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a ultra soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
- Thin PET film, 12 micrometer, carrier supported on 1 side for good converting and handling properties
Product Dimensions |
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| Width | 0 null | |
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Shipping Dimensions |
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| Weight | 8.59803 lb |
|---|---|
| Length | 8.66142 in |
| Width | 12.59843 in |
| Height | 2.55906 in |
PRODUCT FAQ
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What is 3M™ Thermally Conductive Silicone Interface Pad 5583S?
3M™ Thermally Conductive Silicone Interface Pad 5583S is a soft interface pad that provides high thermal conductivity with electrical insulation. It can be used as a gap filler to transfer heat from electronic devices to heat sinks or other cooling solutions.
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What are the dimensions of this product and what is it made of?
The dimensions of this product are 210 mm x 300 mm x
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2.0 mm (8.27 in x11.81 in x0.08 in). It is made up of silicone elastomer with unique ceramic fillers giving excellent thermal performance, which allows it to dissipate heat uniformly while maintaining stable behavior over time.
How does using this product improve my system's performance?
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Using the 3M™ Thermally Conductive Silicone Interface Pad would help you maintain better temperature control inside your electronic systems, leading to improved overall performance and longer lifespan for your components by facilitating better Thermo-Mech
3M™ Thermally Conductive Silicone Interface Pad 5583S has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.