SKU | 7100014139 |
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Legacy SKU | WX300909586 |
UPC | 00051115240782 |
Catalog Number | 5516 |
Product Number | 5516S-05 |
3M Thermally Conductive Silicone Interface Pad 5516S is the same as 3M Pad 5516 but with a polymeric permanent film on 1 side for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes, dielectric strength is improved.
- Good thermal conductivity (3.1 w/m-K)
- Good softness and is conformable at low pressure ( Shore 00 =72)
- Softness results in low stress on board components
- Good dielectric properties
- “S” version incorporates a thin polymeric film carrier for improved handling and a non-tacky surface for ease of rework
- Slight tack allows pre-assembly
Product Dimensions |
Imperial | Metric |
Weight | 0 NULL | |
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Width | 0 null | |
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Height | 0 null | |
Thickness | 20 mil | 0.51 mm |
Shipping Dimensions |
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Weight | 42.09947 lb |
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Length | 19 in |
Width | 13.9 in |
Height | 4.7 in |
PRODUCT FAQ
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What are the dimensions of the 3M™ Thermally Conductive Interface Pad Sheet 5516S?
The pad sheet has a size of 320 mm x 230 mm and thickness of 0.5mm.
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How many sheets come in one case?
One case contains an amount of 80 sheets.
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What is the product number for the Thermally Conductive Interface Pad Sheet?
The product number for this item is 5516S.
3M™ Thermally Conductive Silicone Interface Pad 5516S has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.