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3M™ Thermally Conductive Interface Pad Sheet 5516, 320 mm x 230 mm 1.0 mm, 40/Case
$44.30 / Each
| SKU | 7100011588 |
|---|---|
| Legacy SKU | WX300909552 |
| UPC | 08806080065753 |
| Catalog Number | 5516 |
| Product Number | 5516-10 |
3M Thermally Conductive Silicone Interface Pad 5516 is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.
- Good thermal conductivity (3.1 w/m-K)
- Good softness and is conformable at low pressure ( Shore 00 = 50)
- Softness results in low stress on board components
- Good dielectric properties
- Slight tack allows pre-assembly
- Good wettability for better thermal conductivity
Product Dimensions |
Imperial | Metric |
| Weight | 0 NULL | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null |
Shipping Dimensions |
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| Weight | 9.40051 lb |
|---|---|
| Length | 12.2 in |
| Width | 9.1 in |
| Height | 3 in |
PRODUCT FAQ
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What is the 3M™ Thermally Conductive Interface Pad Sheet 5516?
The 3M™ Thermally Conductive Interface Pad Sheet 5516 is an advanced thermal interface pad designed to transfer heat away from electronic devices.
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How does the sheet work?
The thermally conductive silicone elastomer material of the pad provides a soft, compliant surface for effective interfacing between components and heat sinks or fans.
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What are the dimensions of this product?
This product measures at approximately 320 mm x 230 mm with a height of 1.0mm.
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Is it sold in bulk or individually?
It's sold in cases containing forty pads each. That makes it perfect if you need to order multiple units for large scale industrial usage.
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Can this be used on other surfaces besides electronics?
Yes! While primarily made for electronic device use, these sheets can also aid aircraft manufacturers by removing hot spots and reducing temperatures throughout critical areas as well.
3M™ Thermally Conductive Silicone Interface Pad 5516 has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.