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3M™ Thermally Conductive Silicone Interface Pad 5515S-20, 400 mm x 20 m, 1/Case
$3,052.99 / Roll
| SKU | 7010405214 |
|---|---|
| Legacy SKU | WX300920443 |
| UPC | 08806080068945 |
| Catalog Number | 5515S |
| Product Number | 5515S-20 |
3M Thermally Conductive Silicone Interface Pad 5515S-20 is a conformable silicone elastomer pad. Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders and other cooling devices.
- Good thermal conductivity (2.7 W/m-K)
- Hardness : Shore 90 (±10)
- Good dielectric properties
- UL 94 V-0
- High temperature resistance
- "S" version incorporates a thin polyimide film carrier supported on 1 side for good converting and handling properties
Product Dimensions |
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| Width | 0 null | |
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Shipping Dimensions |
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| Weight | 11.02091 lb |
|---|---|
| Length | 11.22047 in |
| Width | 16.14173 in |
| Height | 5.51181 in |
PRODUCT FAQ
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What are the features of 3M™ Thermally Conductive Silicone Interface Pad 5515S-20?
The 3M™ Thermally Conductive Silicone Interface Pad 5515S-20 is a soft, compressible high-performance interface pad with good thermal conductivity.
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What makes this product reliable for long-term bonding applications?
This thermally conductive interface pad Series offers improved thermal performance with its low-stress silicone construction that provides excellent handling and ease of use, which means that it can maintain consistency in performance over time.
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How much does each case contain?
Each case of the 3M™ Thermally Conductive Silicone Interface Pad contains one roll measuring at approximately 400 millimetres by 20 meters.
3M™ Thermally Conductive Silicone Interface Pad 5515S has a medium-hard pad that conforms to uneven substrates, filling gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.