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3M™ Thermally Conductive Interface Pad Sheet 5595S, 210 mm x 300 mm 2.0 mm, 20/Case
$35.67 / Sheet
| SKU | 7010405202 |
|---|---|
| Legacy SKU | WX300902227 |
| UPC | 00048011570280 |
| Catalog Number | 5595S |
| Product Number | 5595S |
3M Thermally Conductive Silicone Interface Pad 5595S is a soft, silicone elastomer with thermal conductivity of 1.6 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties.
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
- This "S" version has a permanent PEN film, 9 micrometer thick, on 1 side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework
Product Dimensions |
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Shipping Dimensions |
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| Weight | 2.778 lb |
|---|---|
| Length | 8.66063 in |
| Width | 12.59764 in |
| Height | 2.55866 in |
PRODUCT FAQ
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What is 3M™ Thermally Conductive Interface Pad Sheet 5595S made of?
The 3M™ Thermally Conductive Interface Pad Sheet 5595S is made up of a silicone polymer matrix and two sides of electrically conductive metal filler.
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Is the sheet easy to handle and cut for customized sizing?
Yes, absolutely! The sheet can easily be trimmed into any size or shape that you need using standard cutting tools.
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Can I use this pad at higher temperatures compared to other interface pads?
Yes, definitely. The thermally conductive pad has an excellent ability to withstand high temperatures while providing reliable thermal management.
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How does it help with heat dissipation in electronic devices?
The pad improves heat conduction by filling gaps between the components on a circuit board and spreading the heat evenly throughout the system. This reduces hot spots that can cause device failures or damage over time.
3M™ Thermally Conductive Silicone Interface Pad 5595S has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm low-tack layer provides easy handling for pre-assembly and die-cutting. The pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.