through rough waters
3M™ Thermally Conductive Silicone Interface Pad 5591, 210 mm x 300 mm x 1.5 mm, 20 Sheets/Box
$18.93 / Sheet
| SKU | 7010405200 |
|---|---|
| Legacy SKU | WX300901294 |
| UPC | 08806080063728 |
| Catalog Number | 5591 |
| Product Number | 5591-15 |
3M Thermally Conductive Silicone Interface Pad 5591 is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a ultra soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
Product Dimensions |
Imperial | Metric |
| Weight | 0 NULL | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null |
Shipping Dimensions |
|
| Weight | 7.53981 lb |
|---|---|
| Length | 8.66142 in |
| Width | 12.59843 in |
| Height | 2.55906 in |
PRODUCT FAQ
-
What are the applications of 3M™ Thermally Conductive Silicone Interface Pad 5591?
Our silicone interface pad can be used in multiple applications including between heat-generating components and heat sinks, and as a gap filler.
-
Can it withstand high temperatures?
Yes! Our silicone interface pad can operate effectively at a temperature range of -60°C to over 200°C.
-
How many sheets come in one box of the product?
Each box comes with 20 sheets, each sheet measuring at 210 mm x300 mm x1.5 mm.
3M™ Thermally Conductive Silicone Interface Pad 5591 has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.