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3M™ Thermally Conductive Silicone Interface Pad 5549S, 210 mm x 155 mm x 1.0 mm
$43.32 / Sheet
| SKU | 7010352938 |
|---|---|
| Legacy SKU | WX300950739 |
| UPC | 00051131289116 |
| Catalog Number | 5549S |
| Product Number | 5549S-10 |
3M Thermally Conductive Silicone Interface Pad 5549S is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide preferential heat transfer path between heat generating components and heat sinks or other cooling devices.
- Very high thermal conductivity and good electrical insulation properties
- Good softness and conformability even to non-flat surfaces
- Thin polymeric film carrier supported on 1 side for good converting and handling properties
- Slight tack allows pre-assembly
- Good dielectric properties
- Good wettability for better thermal conductivity
Product Dimensions |
Imperial | Metric |
| Weight | 0 NULL | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null |
Shipping Dimensions |
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| Weight | 9.76648 lb |
|---|---|
| Length | 9.64567 in |
| Width | 6.69291 in |
| Height | 2.75591 in |
PRODUCT FAQ
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What is the 3M™ Thermally Conductive Silicone Interface Pad 5549S used for?
The 3M™ Thermally Conductive Silicone Interface Pad 5549S provides excellent thermal management to electronic devices and components.
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Is it suitable for high-temperature applications?
Yes, this pad is designed to withstand temperatures up to 150°C.
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What are the dimensions of this silicone interface pad?
This specific product is sized at 210 mm x 155 mm x1.0 mm.
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Can I customize the size or thickness of the interface pad according to my requirement?
Yes, we provide customization services based on your needs. Please contact us directly with specific requirements so that we can help you develop a tailored solution that fits your application needs.
3M™ Thermally Conductive Silicone Interface Pad 5549S has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.