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3M™ Thermally Conductive Silicone Interface Pad 5584, 210 mm x 300 mm x 1.5 mm
$24.50 / Sheet
| SKU | 7010352936 |
|---|---|
| Legacy SKU | WX300950655 |
| UPC | 08806080063995 |
| Catalog Number | 5584 |
| Product Number | 5584-15 |
3M Thermally Conductive Silicone Interface Pad 5584 is a soft, silicone elastomer with thermal conductivity of 1.1 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties.
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
Product Dimensions |
Imperial | Metric |
| Weight | 0 NULL | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null | |
| Thickness | 60 mil | 1.5 mm |
Shipping Dimensions |
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| Weight | 10.93493 lb |
|---|---|
| Length | 8.66142 in |
| Width | 12.59843 in |
| Height | 2.55906 in |
PRODUCT FAQ
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What is 3M's 3M™ Thermally Conductive Silicone Interface Pad 5584 used for?
The 3M™ Thermally Conductive Silicone Interface Pad 5584 is used to fill air gaps between heat-generating components and heat sinks or metal frames.
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How does the silicone interface pad work?
The silicone material provides a high thermal conductivity, which helps transfer heat away from the source quickly and efficiently. It also conforms well to uneven surfaces, ensuring a reliable contact on all points of contact.
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Can it be customized for different shapes or sizes?
Yes! We can create custom die-cut parts based on your specific application needs.
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Is it easy to remove if needed?
Yes, its low-tack adhesive formula makes it easy to remove without leaving any residue behind.
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Are there any special storage requirements for these pads?
YES. Store these pads in original packaging under dark ambient conditions at temperatures below +40°C (104°F) and above -20°C (-4°F) with <80% relative humidity.
3M™ Thermally Conductive Silicone Interface Pad 5584 has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.