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3M™ Thermally Conductive Interface Pad Sheet 5519, 210 mm x 155 mm x 1.5 mm, 20/Case
$44.97 / Sheet
| SKU | 7010352910 |
|---|---|
| Legacy SKU | WX300909644 |
| UPC | 00051115240843 |
| Catalog Number | 5519 |
| Product Number | 5519-15 |
3M Thermally Conductive Silicone Interface Pad 5519 is a highly conformable, slightly tacky silicone elastomer pad. Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices.
- Very high thermal conductivity (4.9 W/m-K)
- Hardness :Shore 00 = 70
- Good softness and conformability even to non-flat surfaces
- Slight tack allows pre-assembly
- Good wettability for better thermal conductivity
- Good dielectric properties
Product Dimensions |
Imperial | Metric |
| Weight | 0 NULL | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null | |
| Thickness | 60 mil | 1.5 mm |
Shipping Dimensions |
|
| Weight | 8.37757 lb |
|---|---|
| Length | 9.64567 in |
| Width | 6.69291 in |
| Height | 2.75591 in |
PRODUCT FAQ
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What is the 3M™ Thermally Conductive Interface Pad Sheet 5519 made of?
The pad sheet is made of a silicone elastomer material that provides excellent thermal conductivity and high conformability to uneven surfaces.
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Will this interface pad work with my device's components?
The 3M™ Thermally Conductive Interface Pad Sheet 5519 has been tested and found suitable for use with a wide range of electronic devices, including computers, telecommunications equipment, LED lighting systems, and many others.
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How many sheets come in each case?
Each case contains twenty (20) sheets of 3M™ Thermally Conductive Interface Pad Sheet 5519 measuring at a dimension of 210 mm x 155 mm x1.5 mm. This ensures that you have enough material for repairs or assembly projects depending on the scale needed.
3M™ Thermally Conductive Silicone Interface Pad 5519 has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.