through rough waters
3M™ Thermally Conductive Silicone Interface Pad 5584, 210 mm x 300 mm x 0.5 mm
$16.12 / Sheet
| SKU | 7010321496 |
|---|---|
| Legacy SKU | WX300950630 |
| UPC | 18806080063978 |
| Catalog Number | 5584 |
| Product Number | 5584-05 |
3M Thermally Conductive Silicone Interface Pad 5584 is a soft, silicone elastomer with thermal conductivity of 1.1 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties.
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
Product Dimensions |
Imperial | Metric |
| Weight | 0 NULL | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null |
Shipping Dimensions |
|
| Weight | 77.16179 lb |
|---|---|
| Length | 13.77953 in |
| Width | 14.17323 in |
| Height | 17.71654 in |
PRODUCT FAQ
-
What is 3M™ Thermally Conductive Silicone Interface Pad?
3M™ Thermally Conductive Silicone Interface Pad 5584 is a soft, highly conformable silicone material specially formulated for use as thermal interface material.
-
How does it work?
It conducts heat from the device and transfers it to a heatsink or other cooling mechanism. By filling gaps and promoting surface contact, it also increases efficiency by reducing thermal resistance.
-
Why should I choose this product among others?
The pad provides excellent performance with high reliability in many demanding applications such as automotive, communication equipment, power supply units & laptops due to its compliance levels and efficient heat dissipation properties.
-
Can you provide some technical aspect of the product?
: Certainly! Its dimensions are; - length =210 mm x Width=300mm x Thickness =0.5mm , Approximate Bondline thickness after assembly ranges between; (kg/m³)1.
-
It has Thermal conductivity capacity of W/m-K (Watts / meter kelvin); 1-AC87073 (DSC).
3M™ Thermally Conductive Silicone Interface Pad 5584 has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.