through rough waters
3M™ Wafer De-Taping Tape 3305, 25 mm x 100 m
$32.78 / Roll
| SKU | 7010321285 |
|---|---|
| Legacy SKU | JT200085234 |
| UPC | 04548623422213 |
| Catalog Number | 3305 |
| Product Number | 3305 PL |
3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
Product Dimensions |
Imperial | Metric |
| Weight | 0 NULL | |
|---|---|---|
| Width | 0 null | |
| Length | 0 null | |
| Height | 0 null |
Shipping Dimensions |
|
| Weight | 17.63698 lb |
|---|---|
| Length | 10.62992 in |
| Width | 10.62992 in |
| Height | 11.02362 in |
| Color | Green |
|---|
PRODUCT FAQ
-
How does the 3M™ Wafer De-Taping Tape 3305 work to remove tape residue from wafers?
The 3M™ Wafer De-Taping Tape 3305 utilizes a specially formulated adhesive that adheres to the tape residue on wafers, making it easy to lift off and remove without leaving behind any sticky residue.
-
Is the 25 mm x 100 m size suitable for handling various sizes of wafers in semiconductor manufacturing?
Yes, the 25 mm width and generous length of 100 meters make the tape versatile for handling different sizes of wafers commonly used in semiconductor manufacturing processes.
-
Can the 3M™ Wafer De-Taping Tape be easily applied and removed without damaging delicate surfaces?
Absolutely! The tape is designed to be easily applied and removed without causing damage to delicate surfaces such as wafer substrates, ensuring smooth processing in semiconductor production.
-
Does using this de-taping tape help improve overall efficiency in wafer processing operations?
Definitely! By effectively removing tape residue from wafers with minimal effort, the 3M™ Wafer De-Taping Tape helps streamline wafer processing operations, leading to improved efficiency and productivity.
Introducing our innovative transparent polyester film tape, specially engineered with an aggressive rubber adhesive. This tape is specifically designed to effectively remove silicon wafer backgrinding tape, ensuring a seamless and efficient process.