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SKU 7010312589
Legacy SKU 70006335965
UPC 00048011573687
Catalog Number 7303
Product Number 7303

3M ACF 7303 is an epoxy/acrylate-blend adhesive system filled with 43 micron silver-coated glass beads. It is slightly tacky at room temperature and cures at modest bonding temperature and pressure.

  • Heat cure
  • Thermo-set low temperature cure
  • Tacky at room temperature
  • Good thermal stability
  • Reworkable
  • Frozen storage
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On it's way to you May 20   Lead times are estimates and may vary based on our suppliers' product availability.

Qty

Minimum Order 35 Rolls
Order Increment 35 Rolls
Product Dimensions
Imperial Metric
Weight 0.13603 lbs
Width 7.51969 in
Length 6.37795 in
Height 0.35433 in
Shipping Dimensions
Weight 13.56989 lb
Length 23.34646 in
Width 22.99213 in
Height 19.09449 in

PRODUCT FAQ

  1. How is the 3M™ Anisotropic Conductive Film Adhesive 7303 typically used?

    The 3M™ Anisotropic Conductive Film Adhesive 7303 is commonly used for electrical interconnections, such as bonding flat flex cables to printed circuit boards.

  2. Can this adhesive be easily cut or trimmed to fit specific applications?

    Yes! The 8 mm x 35 m roll size of the 3M™ Anisotropic Conductive Film Adhesive allows for easy cutting and trimming to suit your unique project needs.

  3. Is the bulk packaging option convenient for high volume applications?

    Absolutely! With 2 rolls per case in bulk packaging, the 3M™ Anisotropic Conductive Film Adhesive is ideal for high volume production environments, offering efficiency and cost savings.

The 3M ACF 7303 Unbonded Film

The 3M ACF 7303 Unbonded Film is a versatile and innovative product designed for bonding flexible printed circuits. This film is composed of a thermosetting epoxy/acrylate adhesive matrix that is loaded with conductive particles. These particles enable the interconnection of circuit lines through the adhesive thickness, while still maintaining electrical insulation in the plane of the adhesive.

One of the key features of the 3M ACF 7303 Unbonded Film is its slightly tacky nature at room temperature. This characteristic allows for easy handling and application, ensuring a secure bond between flexible printed circuits. The film is specifically designed to bond flexible printed circuits to other flexible printed circuits or to a printed circuit board.

When it comes to electrical performance, the 3M ACF 7303 Unbonded Film excels. It is particularly effective for copper traces, as the hard conductive particles embedded in the film provide excellent electrical conductivity. This ensures reliable and efficient performance of the bonded circuits.

With a standard lead time of 14 calendar days, the 3M ACF 7303 Unbonded Film offers a reliable and efficient solution for bonding flexible printed circuits. Its unique composition and superior electrical performance make it an ideal choice for various applications in the electronics industry.

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Lead times are estimates and may vary based on our suppliers' product availability.