SKU | 7010305060 |
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Legacy SKU | WX300902201 |
UPC | 00048011570266 |
Catalog Number | 5595S |
Product Number | 5595S-10 |
3M Thermally Conductive Silicone Interface Pad 5595S is a soft, silicone elastomer with thermal conductivity of 1.6 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties.
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
- This "S" version has a permanent PEN film, 9 micrometer thick, on 1 side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework
Product Dimensions |
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Shipping Dimensions |
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Weight | 15.2119 lb |
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Length | 8.66142 in |
Width | 12.59843 in |
Height | 2.55906 in |
PRODUCT FAQ
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What is 3M™ Thermally Conductive Interface Pad Sheet 5595S?
3M™ Thermally Conductive Interface Pad Sheet 5595S is a highly conformable, thermally conductive material that provides excellent heat transfer between high heat generating components and heat sinks or housings.
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What size does it come in and how many are included per case?
The product comes in the size of 210 mm x 300 mm with a thickness of 1.0 mm. There are approximately forty pieces included per case.
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What kind of applications can this product be used for?
This interface pad sheet can be used in various applications such as LED lighting, mobile devices, automotive electronics, aerospace & defense electronics.
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Can I get any technical support to use this effectively for my application needs?
Yes! Our technical support team is always ready to help you through any issues you might have while using our products. You're also welcome to explore our website where we provide comprehensive information about suggested uses and product specs to make your experience hassle-free!
3M™ Thermally Conductive Silicone Interface Pad 5595S has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm low-tack layer provides easy handling for pre-assembly and die-cutting. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.