through rough waters
3M™ Thermally Conductive Silicone Interface Pad 5584, 210 mm x 300 mm x 2.0 mm
$29.64 / Sheet
| SKU | 7010297941 |
|---|---|
| Legacy SKU | WX300950663 |
| UPC | 18806080064005 |
| Catalog Number | 5584 |
| Product Number | 5584-20 |
3M Thermally Conductive Silicone Interface Pad 5584 is a soft, silicone elastomer with thermal conductivity of 1.1 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties.
- Good thermal stability of the base polymer with excellent softness of the thermal pad
- Good thermal conductivity in a soft silicone polymer base
- The product tack is such that a mechanical means to support the pad in a final assembly is required
Product Dimensions |
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Shipping Dimensions |
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| Weight | 12.56635 lb |
|---|---|
| Length | 8.66142 in |
| Width | 12.59843 in |
| Height | 2.55906 in |
PRODUCT FAQ
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What is the purpose of the 3M™ Thermally Conductive Silicone Interface Pad 5584?
The 3M™ Thermally Conductive Silicone Interface Pad 5584 is designed to transfer heat away from electronic components, ensuring that they stay cool and function correctly.
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How does it work?
The pad consists of a silicone rubber matrix filled with thermally conductive ceramic particles. When placed between a heat-generating component and a cooling device, such as a heat sink or chassis, it conducts heat away from the component and disperses it throughout the system.
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What are its dimensions?
The dimensions of this particular pad are 210 mm x 300 mm x 2.0 mm.
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Is it compatible with other adhesives or thermal interface materials?
:Yes! It can be used in conjunction with other types of adhesives and interfaces if necessary to meet specific product requirements.
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Is this product easy to use/cut/trim/etc. for various applications?
:Absolutely! This interface pad can be easily cut to size using conventional tools like scissors or blades for odd shapes required by customers' application/processes.
3M™ Thermally Conductive Silicone Interface Pad 5584 has an ultra-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Examples:
- LED displays
- Electric vehicle (EV) batteries
- Wireless charging units
- Satellite navigation
- Sensors
- Process control equipment
- Test & measurement devices
Our family of 3M(TM) Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs. Some pads can be customized beyond standard thicknesses for advanced designs.